Customization: | Available |
---|---|
Application: | Semiconductor, 3D Hot Bending Glass Die |
Carbon Content: | High-Carbon |
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tem
|
Unit
|
Material 1
|
Material 2
|
Max Grain size
|
mm
|
0.8
|
0.8
|
Bulk Density
|
g/cm3
|
≥1.70
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≥1.73
|
Electric Resistance
|
μΩ.m
|
≤8.5
|
≤8
|
Bending Strength
|
MPa
|
≥10
|
≥12
|
Compressive Strength
|
MPa
|
≥24
|
≥31
|
Thermal Conductivity
|
W/(m.K)
|
≥120
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≥130
|
C.T.E(100-600)ºC
|
10-6/ºC
|
≤2.5
|
≤2.5
|
Ash Content
|
%
|
≤0.3
|
≤0.3
|
Shijiazhaung Nalai Biotechnology Co., Ltd
Q1:Are you a factory or trader?
A1:We are directly factory combined production and export and one of the biggest factory in China.
Q2:Can we visit your factory?
A2:Yes, welcome to visit our factory any time.
Q3:What's your payment?
A3:TT
Q4:Can you send sample?
A4:Yes, we can send you free charge sample, you only pay for international courier charge.
Q5:How to guarantee high quality goods?
A5:We like to send you sample from goods randomly, you can inspect the goods or test it by SGS or B.V. or Intertek.
Q6:What's your delivery time?
A6:Generally 7--15 days after payment for small qty and will inform you when large qty or special order.
Q7:Is there any discount?
A7:Yes, we can consider to give you a discount for first deal and regular order and for good payment.