Customization: | Available |
---|---|
Application: | Semiconductor, 3D Hot Bending Glass Die |
Carbon Content: | High-Carbon |
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tem
|
Unit
|
Material 1
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Material 2
|
Max Grain size
|
mm
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0.8
|
0.8
|
Bulk Density
|
g/cm3
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≥1.70
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≥1.73
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Electric Resistance
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μΩ.m
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≤8.5
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≤8
|
Bending Strength
|
MPa
|
≥10
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≥12
|
Compressive Strength
|
MPa
|
≥24
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≥31
|
Thermal Conductivity
|
W/(m.K)
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≥120
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≥130
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C.T.E(100-600)ºC
|
10-6/ºC
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≤2.5
|
≤2.5
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Ash Content
|
%
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≤0.3
|
≤0.3
|
The Application
1. Diamond Tool Pressure Sintering
2. Die Moulds
3. Continuous Casting Dies for Aluminium,Copper and Brass
4. Degassing Rods
5. Crucibles and Sealing Rod
6. Semi Conductor applications
7. Solar Technology applications
8. EDM Applications
Shijiazhaung Nalai Biotechnology Co., Ltd
Q1:Are you a factory or trader?
A1:We are directly factory combined production and export and one of the biggest factory in China.
Q2:Can we visit your factory?
A2:Yes, welcome to visit our factory any time.
Q3:What's your payment?
A3:TT
Q4:Can you send sample?
A4:Yes, we can send you free charge sample, you only pay for international courier charge.
Q5:How to guarantee high quality goods?
A5:We like to send you sample from goods randomly, you can inspect the goods or test it by SGS or B.V. or Intertek.
Q6:What's your delivery time?
A6:Generally 7--15 days after payment for small qty and will inform you when large qty or special order.
Q7:Is there any discount?
A7:Yes, we can consider to give you a discount for first deal and regular order and for good payment.